Staff Engineer

About the CompanySamsung Electronics is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, medical devices, semiconductors and LED solutions. To discover more, please visit our website at ww.samsung.com and our official newsroom at news.samsung.com

About the Role Our Singapore Research & Development office is seeking a talented and motivated professional to join our ranks. Successful candidate will support the research and development of advanced packaging activities in the Singapore research center together with R&D teams in headquarter Korea and other countries.

ResponsibilitiesPerform design and fabrication of Micro lens array (MLA) and detachable fiber array unit (DFAU) with vendors, and actively develop alignment process of MLA and DFAU to Grating/Edge/Evanescent couplers of Photonics IC (PIC) for CPO.Propose detachable solutions of DFAU with passively mating receptacles or housings or other approaches focused on prototyping and high-volume manufacturing levels. Actively perform design review and evaluation test and share the results with team. Perform optical interconnect design and fabrication with optical waveguides, prisms and mirrors, etc.Manage project development for DFAU package prototyping and mass production, including product specification definition, assembly and testing, and procurement of required facilities & equipment.Characterize FAU coupled OE/CPO packages/assemblies and perform FMEA.Perform optical simulation using Lumerical and Zemax and actively share to team the to optimize couplers of PIC and micro optic parts like lens and FAU for best coupling efficiency.

QualificationsMasters/PhD in Electrical/Electronic Engineering.At least 5 years of working experience in photonic packaging design and fabrication and evaluation. Strong domain knowledge and experience in photonic packaging design, implementation and characterization.Knowledge of current and future technologies of optical engine and CPO is a plus.Experience and knowledge in CPO in project planning and execution for OE/CPO packages/assemblies.

Required SkillsExperience in new project development is beneficial.Understanding different 3D IC packaging methodologies is a plus.Excellent problem solving, communication and cross functional collaboration skills. Able to work independently, or work in a team to identify and solve complex problems.NPI and Productization experience is a plus.